Decorated rigid panel

ABSTRACT

A panel includes a thermoset material, and an image comprising sublimation ink. The sublimation ink is absorbed in the thermoset material. The rigid component may be a rigid structure formed by the thermoset material. The panel may be for a bath or shower enclosure.

CROSS-REFERENCE TO RELATED PATENT APPLICATIONS

This application claims priority to and the benefit of U.S. ProvisionalPatent Application No. 61/635,430, filed Apr. 19, 2012, the entiredisclosure of which is incorporated herein by reference in its entirety.

BACKGROUND

The present disclosure relates to forming imagery on articles. Moreparticularly, the present disclosure relates to forming and decoratingpanels or rigid components using a dye sublimation process.

Decorative images are often formed on various different articles, suchas consumer products, clothing, packaging, signage, and the like. Imagesmay include, for example, pictures, words, logos, patterns or otherdesigns, alone or in combination with each other and/or many otherpossible images.

Many different methods have been employed to form images onto thesevarious articles, such methods often being determined according to imageand article characteristics (e.g., image durability, object shape andsize, object material, etc.).

For example, various printing methods (e.g., inkjet printing, screenprinting, etc.) have been used to form images with ink onto the variousdifferent substrates of particular items (e.g., plastic, metal, cloth,natural fibers, etc.). Depending on the article and image type, printingmay offer various advantages or may suffer from various otherdisadvantages. For example, printing may offer flexibility and quickchangeover for printing different images on similar articles (e.g.,shirts). However, direct printing may require specialized equipmentsuited only for use with a particular item having unique characteristics(e.g., substrate material, size, shape, etc.), may provide limiteddurability since the ink is typically deposited on a surface of thearticle, and/or may require relatively long printing times and highexpenses, especially associated with printing large items.

Another method for forming images on different articles is dyesublimation, which involves heating a specialized ink or dye thatconverts directly from a solid to a gas, such that the gaseous ink maybe absorbed into the surface of the item. Dye sublimation generallyinvolves providing a carrier or transfer film with an image formedthereon with sublimation ink, holding the carrier with the sublimationink against the substrate with a low pressure (e.g., 5 or 10 psi), andheating the substrate and ink to a temperature at which the ink convertsto a gaseous state and can be absorbed into the substrate. Dyesublimation may offer various advantages or suffer from various otherdisadvantages depending on the article and image type. For example, dyesublimation has been found to be useful on fabrics and small noveltyitems. However, dye sublimation typically requires heating an article tohigh temperatures (e.g., 400 degrees Fahrenheit) that may causedeformation to the article, requires specialized equipment (e.g., toheat an article and/or hold a carrier in fixed position against thearticle, such as a dye sublimation press, which typically operate at 60psi or less), requires a polymeric substrate which often requiresapplication of a gel coat or polymeric powder coat to the surface of thearticle for absorbing the gaseous sublimation ink, and is generallylimited to two-dimensional surfaces.

One recent application includes construction sheet goods with simulatednatural surfaces, such as stone (e.g., marble, granite, etc.) and wood,which may be used in construction projects in lieu of a correspondingnaturally occurring material with higher cost and maintenancerequirements. These sheet products are known to be imprinted using a dyesublimation process, such as that described above, but have been limitedto cast polymers, ceramics, or metal that have required application andcuring of a polymeric gel coat or powder coat and/or subsequent heatingof the sheet product prior to transferring an image to the product.

It would be advantageous to provide an article with an image in a mannerthat addresses at least some of the shortcomings associated withconventional printing and dye sublimation methods.

SUMMARY

According to an exemplary embodiment, a panel includes a thermosetmaterial, and an image formed using a sublimation ink. The sublimationink is absorbed into the surface of the thermoset material. The panelmay be a generally rigid structure formed by the thermoset material. Thepanel may be for a bath or shower enclosure.

According to an exemplary embodiment, a compression molded componentincludes a homogenous polymer-based substrate, and an image comprising asublimation ink. The sublimation ink is absorbed in the homogenouspolymer-based substrate. Glass fibers may be distributed generallyevenly throughout the substrate. The compression molded component may bea generally rigid structure formed by the homogenous polymer-basedsubstrate. The compression molded component may be a wall panel for abath or shower enclosure.

According to an exemplary embodiment, a method for forming a compressionmolded component includes providing a compression molded componentcomprising a polymer-based substrate, providing a carrier with atransfer image comprising sublimation ink, and pressing the carrieragainst the rigid component at a pressure above approximately 100 psiand heating the sublimation ink to greater than approximately 330degrees Fahrenheit. The step of providing a compression molded componentmay comprise forming the compression molded component by pressing asubstrate material in a press, and heating the substrate material to atemperature of between approximately 300 and 350 degrees Fahrenheituntil the substrate material becomes rigid. The step of pressing thecarrier against the rigid component comprises inserting the carrier intothe press prior to removing the compression molded component.

According to an exemplary embodiment, a decorated rigid structureincludes a thermoset material and an image. The thermoset material formsa rigid structure. The image is on a surface of the rigid structure andincludes sublimation ink absorbed in the thermoset material. 7.

According to an exemplary embodiment, a method of providing a decoratedcompression molded component includes placing a carrier with a transferimage onto the compression molded component. The compression image isformed of a sublimation ink. The method also includes transferring atleast a portion of the sublimation ink to the compression moldedcomponent by pressing the carrier against the compression moldedcomponent at a pressure above approximately 100 psi and simultaneouslyheating the sublimation ink to between approximately 300 degreesFahrenheit and approximately 360 degrees Fahrenheit until thesublimation ink sublimates and is absorbed into the compression moldedcomponent to form a transferred image thereon

According to an exemplary embodiment, a method of forming a decoratedcompression molded component includes inserting uncured thermosetmaterial between an upper tool and a lower tool. The upper tool and thelower tool having different three-dimensional surfaces for shaping theuncured thermoset material. The method also includes pressing theuncured thermoset material between the upper tool and the lower tool andsimultaneiously heating the uncured thermoset material to shape and curethe thermoset material into the compression molded component. The methodadditionally includes inserting a carrier with an image between thecompression molded component. The image is formed with a sublimationink. The method includes pressing the carrier between the upper tool andthe compression molded component until the sublimation ink sublimatesand is sufficiently absorbed in the thermoset material to form an imageon the compression molded component. The method still further includesremoving the compression molded component from between the upper tooland the lower tool.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic drawing illustrating components used for providinga rigid component with imagery in a dye sublimation process according toan exemplary embodiment.

FIG. 2 is a flow chart of a method for providing a rigid component withimagery according to an exemplary embodiment.

DETAILED DESCRIPTION

According to an exemplary embodiment, a member or structure, such as amodular bath or shower panel includes an image, which is formed withsublimation ink. The bath or shower panel comprises a polymer-basedsubstrate and is formed by a compression molding process in which thesubstrate is compressed between two heated tools and heated until curedduring a first pressing operation. The sublimation ink is applied to thepanel by way of a carrier, which is compressed between the panel and theupper heated tool during a second pressing operation in which thesublimation ink is transferred from the carrier to the substrate of thepanel.

According to an exemplary embodiment, a shower or bath includes one ormore modular rigid components or panels 40, such as a wall panel, door,ceiling, shower receptor (i.e., a floor or base), tub base, and thelike. The panels 40 are coupled to a generally hidden support structureand/or each other so as to define a bath or shower enclosure. The one ormore panels 40 may be generally planar, or may include a threedimensional profile or shape configured for aesthetic, water shedding,or other purposes. According to the exemplary embodiment shown in FIG.1, the panel 40 is a wall panel that may include a three-dimensionalimpression of tile and/or grout or other aesthetic designs.

According to other exemplary embodiments, the rigid component may be ashower receptor that is sloped and/or includes ledges to direct watertoward a drain, a tub base that includes a recess or shelf for storinghygiene products, and the like. According to other exemplaryembodiments, the rigid component may be a flat or planar panel or sheet,a sink (e.g., a lavatory, utility, or kitchen sink), bathtub,countertop, integrated sink and countertop (i.e., integrated top andbowl), or any other large format article for which it may be desirableto provide imagery.

According to an exemplary embodiment, the panel 40 or other rigidcomponent comprises a substrate material having one or more polymericconstituent ingredients. The substrate material is formed from agenerally homogeneous material, such as polymer-based thermoset materialthat is filled with glass fiber that is generally evenly distributedthrough within thermoset material. The thermoset material may include apolyester resin having one or more fillers materials (e.g., calciumcarbonate) and may further include other minor constituent ingredients.The polyester resin may be provided in quantities of approximately15-45% by weight (e.g., approximately 17-19%), while filler materials(e.g., calcium carbonate) may be provided in quantities of approximately5-70% by weight, such as approximately 40-70% or approximately 62-64%.Glass content (e.g., chopped glass fibers) may, for example, beapproximately 5-45% by weight, such as approximately 11-14%. Accordingto other exemplary embodiments, the substrate material may includedifferent polymer resin materials (e.g., acrylic, urethane, epoxy, vinylesters, etc.), other fibrous strengthening materials carbon fiber,aramid fiber, polypropylene fiber (i.e., in addition to or instead ofchopped glass fibers), other constituent ingredients of approximately0-10% (e.g., pigment, catalyst, mold release, thickening agent, forcontrolling material shrinkage, for facilitating cross-linking, etc.),or other materials consistent with present disclosure as will berecognized by those skilled in the art.

According to an exemplary embodiment, the substrate material is providedin the form of a charge 20. The charge 20 is formed by providing a firstlayer of the homogeneous paste material, depositing chopped glass fibersover the first layer of paste material, and applying a second layer ofpast material over the glass fibers. After 1-7 days of thickening ormaturing, the substrate material may then be folded over itself severaltimes (e.g., five to ten times), thus resulting in a multi-layer charge20 having smaller width and length (e.g., approximately 10-30″×10-30″,such as approximately 18″×18″) than the width and length of the finalpanel 40 or rigid component (e.g., approximately 2-10′×3-10′, such asapproximately 5′×5′). According to other exemplary embodiments, thecharge 20 and panel 40 or other rigid component may be formed in othermanners and other sizes consistent with the present disclosure as willbe recognized by those skilled in the art.

According to an exemplary embodiment, the panel 40 or rigid component isformed by a compression molding process. The charge 20 is inserted intoa press 10 between complementary upper and lower tools 12, 14 of adesired shape. Closing of the press 10 causes the upper and lower tools12, 14 to compress the charge 20 causing the uncured substrate materialto flow between the upper and lower tools 12, 14, resulting in a panel40 of desired shape with glass fibers distributed generally evenlythroughout the substrate material. The complementary upper and lowertools 12, 14 may have complementary three-dimensional impressions, whichare configured to provide the panel 40 with a desired aestheticappearance (e.g., tiles and grout), functional shape (e.g., for waterdirection, shelves, etc.), and/or additional features (e.g.,strengthening or attachment features, such as ribs, bosses, flanges,apertures, etc.). If a three-dimensional shape is provided, the upperand lower tools 12, 14 may be configured to provide the panel 40 with agenerally constant thickness, such that the contours of an outeraesthetic surface are followed by those of an inner hidden surface. Theupper and lower tools 12, 14 may also be configured to form the panel 40as a flat sheet (e.g., like conventional sheet goods used in theconstruction industry). As described above, a rigid component havingdifferent shape or purpose than a panel 40 may be formed including, forexample, a bathtub, shower receptor, sink, integrated top and bowl,countertop, etc.

According to an exemplary embodiment, the upper and lower tools 12, 14may be heated. For example, the upper and lower tools 12, 14 may each bemade from a specialized steel or other suitable material and includefluid or gas conduits or piping running therethrough for carrying aheating liquid or gas, such as water or steam, or another liquid or gas.Heat is transferred from the liquid so as to heat the tools 12, 14,including their surfaces that directly engage the substrate material ofthe charge 20. Depending on the particular substrate material and itsconstituent ingredients, the upper tool 12 may be heated to betweenapproximately 270 and 360 degrees Fahrenheit (e.g., between 315 and 345degrees Fahrenheit), and the lower tool 14 may be heated to betweenapproximately 270 and 360 degrees Fahrenheit (e.g., betweenapproximately 285 and 315 degrees Fahrenheit). Furthermore, the upperand lower tools 12, 14 may be heated to different temperatures than eachother (e.g., with a difference of between 15 and 45 degrees Fahrenheit,such as approximately 30 degrees Fahrenheit), for example, to facilitatecuring of the substrate material 20, to achieve desired aesthetics ofthe panel 40, and/or to facilitate removal of the panel 40 from thepress 10. According to other exemplary embodiments, the upper and lowertools 12, 14 may be configured in other manners, for example, withdifferent materials, with different temperatures (e.g., higher, lower,lower or higher differential), and in other manners consistent with thepresent disclosure as will be recognized by those skilled in the art.

According to an exemplary embodiment, the press 10 is configured topress the upper and lower tools 12, 14 to a desired gap or spacing thatcorresponds to a desired thickness of the panel 40 or rigid component.For example, the lower tool 12 may be held in a fixed position, whilethe press 10 is configured to raise and lower the upper tool 12 over topthe lower tool 14 to a generally constant spacing of betweenapproximately between 110 and 500 thousandths of an inch (e.g.,approximately 160-170 thousandths of an inch). The press 10 may, forexample, be up to an approximately 4000 ton press capable of achievingmaximum pressures of approximately 500-1800 psi. According to otherexemplary embodiments, other presses may be used having other suitableparameters as will be understood by those skilled in the art.

According to an exemplary embodiment, the substrate material 20 isformed into the panel 40 or rigid component during a first pressingoperation. That is, the panel 40 is a compression molded componentformed during a compression molding process. The charge 20 is insertedinto the press 10 (i.e., placed between the upper and lower tools 12,14). The press 10 forces the upper tool 12 over the lower tool 14 to thedesired spacing (i.e., the thickness of the panel), such that thesubstrate material of the charge 20 flows between the upper and lowertools 12, 14 to form the substrate material into the desired shape ofthe panel 40. Heat from the upper and lower tools 12, 14 cures thesubstrate material, so as to become rigid and form a generally rigidstructure (i.e., the panel 40). For example, during the first pressingoperation, the press 10 may compress the substrate material betweenapproximately 500 psi and 1800 psi (e.g., between approximately 800 and1200 psi) for a dwell time of between approximately 90 seconds and 10minutes (e.g., approximately two to five minutes). The dwell time isconfigured to be sufficient for the substrate material to cure to formthe panel 40 into a rigid component with longer dwell times generallyrequired for thicker material. The press 10 then lifts the upper tool 12to allow removal of the panel 40 for cooling, decorating, subsequentprocessing, packaging, etc. According to other exemplary embodiments,the first pressing operation may occur in other manners as will berecognized by those skilled in the art.

According to an exemplary embodiment, the panel 40 or rigid componentincludes imagery 42 formed from sublimation ink. A transfer image 32 isformed on a carrier 30 from which the sublimation ink is thentransferred to the panel 40 during a decorating step or second pressingoperation to form the final imagery 42 thereon. The final imagery 42may, for example, be a geometric pattern, solid color, replication of anatural material (e.g., stone or wood), picture, logo or insignia,inscription, alone or in combination with each other or any otherdesirable image (e.g., the and grout, landscape or other picture, etc.).

According to an exemplary embodiment, the sublimation ink is configuredto convert from a solid directly into a gas that can be absorbed by thepanel 40 or rigid component (i.e., into the cured substrate material).The sublimation ink may, for example, be configured to sublimate (i.e.,convert from a solid directly into a gas) at between approximately 375and 425 degrees Fahrenheit at nominally atmospheric pressure or lowpressures (i.e., within approximately 25 psi of atmospheric pressure).Exemplary sublimation inks are available under the trade names SubliMfrom Sawgrass Technologies, Inc. of Charleston, S.C., and Visi-Sub fromOcti-Tech, Ltd. of Sheffield, United Kingdom. According to otherexemplary embodiments, the sublimation ink may be configured tosublimate at other temperatures, such as between approximately 325 and375 degrees Fahrenheit (e.g., approximately 350 degrees Fahrenheit),below 325 degrees Fahrenheit (e.g., approximately 284 degreesFahrenheit), above 425 degrees Fahrenheit, or at any other suitabletemperature.

According to an exemplary embodiment, the transfer image 32 is formedfrom sublimation ink on the carrier 30 (e.g., carrier layer, or transferfilm). The carrier 30 may, for example, be paper (e.g., with a weight ofbetween approximately 15 g/m² and 200 g/m², such as approximately 100g/m²), fabric, or a thin polymeric layer generally capable ofwithstanding temperatures at or above the sublimation temperature of thesublimation ink thereon without significant degradation or deformation.Heavier paper layers may advantageously carry higher ink densities.According to other exemplary embodiments, the carrier 30 may beconfigured in other manners consistent with the present disclosure aswill be recognized by those skilled in the art.

According to an exemplary embodiment, the transfer image 32 may beformed on the carrier 30 according to any method suitable for both thesublimation ink and the carrier material. When deposited onto thecarrier layer, the sublimation ink may be in a liquid form thatsubsequently dries into a solid layer. For example, the transfer imagemay be printed onto the carrier as a liquid using methods such as inkjet printing, offset printing, laser printing, or non-spraying methods,such as silk screening. According to other exemplary embodiments, thetransfer image may be formed according to other methods as will berecognized by those skilled in the art.

According to an exemplary embodiment, the transfer image 32 and carrierlayer 30 are configured according to the desired placement of the finalimage 42 on the panel 40 or other rigid component. For example, it maybe desirable for the final image 42 to cover the entire outer or exposedsurface of the panel 40. According to other exemplary embodiments, itmay be desirable for the final image 42 to cover less than the entireouter surface of the panel 40. For example, the final image 42 may berestricted to between 40% and 80% of the outer surface (e.g., 60%), maybe a broken image covering only select portions or regions of theexposed surface (e.g., corresponding to simulated tiles but not groutthere between), may be provided on only generally coplanar portions ofthe panel 40 (e.g., raised tile portions), may be provided onnon-coplanar portions having a generally smooth and/or continuouscurvature (e.g., with a draft angle of approximately 1 degree or more,depth of approximately ¼″ or less, etc.), such as raised tile portionsand recessed grout portions. It also noted that, because the papercarrier 30 is generally not elastic, that the carrier 30 may sheer innon-planar regions during the second pressing operation, which isdiscussed in further detail below. Accordingly, the carrier 30 may beconfigured in other manners to accommodate these non-planar regionsincluding, for example, providing coloring but not particular images inareas where the carrier 20 may sheer (e.g., grout lines, sharpfeatures), not providing coloring in non-planar regions (e.g., no ink,cutout in the carrier, etc.). Furthermore, surfaces to be decoratedshould may be aligned generally orthogonal to tool travel in order toprevent movement of the carrier 30 when the press is closed (e.g.,within approximately 10 degrees of orthogonal).

According to an exemplary embodiment, the sublimation ink of thetransfer image 32 is configured to transfer to the panel 40 to form theimagery 42 with a desired appearance. The carrier layer 30 and substratematerial have different properties and interact with the sublimationinks in different manners, such that the transfer image 32 on thecarrier 30 may appear different than the final imagery 42 on the curedsubstrate material of the panel 40. More specifically, the transferimage 32 and final imagery 42 may appear different, because thesublimation ink is printed onto a surface of the carrier 30 (e.g., whitepaper) in liquid form to form a layer thereon, while the sublimation inkis transferred to the panel 40 in gaseous form and is absorbed into thecured substrate material 20 with different properties (e.g., coloring ofthe substrate material, translucency, etc.). Thus, in order to achieve adesired final imagery 42 of the panel 40, the transfer image 32 on thecarrier 30 may be adjusted in color and saturation to achieve thedesired final imagery 42 on the panel 40. For example, proper color andsaturation of the sublimation ink may be determined by printing a sampletransfer image 32 with multiple colors (e.g., squares of differentcolors), transferring the ink of the carrier image 32 to a blank ofcured substrate material, evaluating color replication in the finalimage 42 and the transfer image 32 (e.g., comparing imagecharacteristics of the final image with transfer image), evaluating inkabsorbency of the cured substrate material (e.g., saturated capacity),and/or correspondingly adjusting the sublimation ink color and/orsaturation of the transfer image 32 in order to provide the final image42 with the desired appearance.

According to an exemplary embodiment, to transfer the transfer image 32from the carrier 30 to the panel 40 or rigid component, the carrier 30is positioned adjacent the panel 40 with the transfer image 32 againstthe outer, aesthetic surface of the panel 40 (i.e., image side down).The sublimation ink is then heated until it sublimates and the carrier30 is held in position against the panel 40 for a duration sufficientfor the sublimation ink, in gaseous form, to be absorbed by thesubstrate material to form the intended final imagery 42 of the panel40. Generally speaking, shorter holding durations may result in lighterimages, while longer holding durations may result in darker, moresaturated images, since more sublimation ink may be absorbed into thesubstrate material and/or ink may also be absorbed deeper into thesubstrate surface. Furthermore, shorter holding durations may result insharper images, while longer holding durations may result in imagebleeding, since the additional sublimation ink may migrate laterally.Accordingly, the holding duration may be adjusted according to thedesired final imagery 42 of the panel 40. According to one exemplaryembodiment, the panel 40 is heated prior to application of the carrier30, and the sublimation ink reaches its sublimation temperature due, atleast in part, to heat transferred from the panel 40.

According to an exemplary embodiment, the transfer image 32 istransferred from the carrier 30 to the panel 40 or rigid componentduring a second pressing operation. Subsequent to the first pressingoperation in which the panel 40 or other rigid component is formed andthe substrate material is cured (as described above), the upper tool 12is removed (i.e., lifted) from the upper surface of the panel 40, butthe panel 40 is not removed from the lower tool 14. The carrier 30 isinserted image side down into the press 10 between the panel 40 and theupper tool 12. The carrier 30 is held in position with the transferimage 32 against the panel 40, for example, with electrostatic forces orphysical holding devices. The upper tool 12 is then lowered by the press10 over the carrier 30, panel 40, and lower tool 14, so as to compressthe carrier 30 between the upper tool 12 and the panel 40. Heat from thepanel 40 and the tools 12, 14 is transferred to the sublimation ink ofthe transfer image 32, which is heated until sublimating into a gaseousstate for transfer and absorption into the substrate material of thepanel 40. The carrier 30 may be compressed between the upper tool 12 andthe panel 40 at pressures of between approximately 200 psi and 600 psi(e.g., between approximately 385 and 415 psi), or at any other suitablepressure. As described above, the holding or pressing duration or dwelltime may be determined according to the desired final image (e.g.,darkness and sharpness), which may also be influenced by temperature andpressure. For example, the decorating operation may utilize a dwell timeof between approximately 30 seconds and ten minutes (e.g., betweenapproximately and four minutes.

According to an exemplary embodiment, the carrier 30 is transferred intothe press 10 via one or more machines. For example, a conveyor systemand/or vacuum handler may be used to move and/or lift the carrier 30into position in the press 10 and/or over the rigid component 10, andpistons or other actuators may be used to move the carrier against therigid component 10 into precise placement. According to other exemplaryembodiments, other means or methods may be used to insert the carrier 30into the press 10 (e.g., hand placement).

Applicants unexpectedly discovered that by employing a second pressingoperation, the sublimation ink may be heated to temperatures lower thanthose normally required for sublimation (e.g., within approximately375-425 degrees Fahrenheit), while still achieving desired final imagequality on the panel 40. Applicants believe that the lower temperaturesin combination with substantially raised pressures still cause thesublimation ink to sublimate into a gaseous state for transfer to andabsorption into the substrate material of the panel 40.

According to one exemplary embodiment, a sublimation ink that sublimatesat approximately 375 to 425 degrees Fahrenheit at low pressure (e.g.,within approximately 25 psi of atmospheric pressure) may render desiredimage quality on the panel 40 or rigid component while using a lowertool heated to approximately 300 degrees Fahrenheit, an upper toolheated to approximately 330 degrees Fahrenheit, and a pressure ofbetween approximately 385 and 415 psi (e.g., approximately 400 psi).During the second pressing operation, the sublimation ink will reach amaximum temperature of approximately 330 degrees Fahrenheit (i.e., thetemperature of the upper tool 12), but will still sublimate or otherwisebe transferred into the substrate material of the panel 40 and achieve afinal image 42 of desired quality. According to other exemplaryembodiments, sublimation inks may be used that normally sublimate atdifferent temperatures (e.g., as described above), the tools 12, 14 maybe heated to other temperatures (e.g., higher, lower, and/or the same aseach other), and the press may create other pressures (e.g., higher,lower, varying, and the like) in combination with each other and/orother suitable parameters consistent with the present disclosure.

According to an exemplary embodiment, a method is provided for providinga panel or rigid component with imagery. The method generally includes,providing a substrate material (Step 101), pressing the substratematerial with tools to form the panel or rigid component (Step 102),providing a carrier having a transfer image formed from sublimation ink(Step 103), and transferring the transfer image from the carrier to therigid component (Step 104). It should be understood that these steps andthe substeps (described below) may be performed in any suitable orderand/or combination, even eliminating one or more steps or substeps, inmanners consistent with the present disclosure and/or as would berecognized by those skilled in the art.

According to an exemplary embodiment, the step of providing a substratematerial (Step 101) may include one or more of the following substeps inany suitable combination: (a) providing a substrate material thatcomprises a homogeneous mixture comprising resin and filler (Step 101a); (b) providing a substrate material that is a polymer-based thermosetmaterial (Step 101 b); (c) providing a substrate material that comprisesa polyester resin (Step 101 c); (d) providing the substrate materialwith glass fibers (Step 101 d); (e) providing the substrate material asa charge that has a smaller length and width than the panel or rigidcomponent; and/or (f) placing a substrate material into a press betweenupper and lower tools (Step 101 f).

According to an exemplary embodiment, the step of pressing the substratematerial to form the rigid component (Step 102) may include one or moreof the following substeps in any suitable combination: (a) heating theupper tool to between approximately 300 and 360 degrees Fahrenheit(e.g., between approximately 315 and 345 degrees Fahrenheit) (Step 102a); (b) heating the lower tool to between approximately 270 and 330degrees Fahrenheit (e.g., between approximately 285 and 315 degreesFahrenheit) (Step 102 b); (c) heating the substrate material with theupper and/or lower tools (Step 102 c); (d) compressing the substratematerial between the upper and lower tools to a pressure of betweenapproximately 500 psi and 1800 psi (e.g., between approximately 800 and1200 psi) (Step 102 d); (e) maintaining pressure and/or heat for a dwelltime of between approximately 90 seconds and ten minutes to cure thesubstrate material (e.g., approximately two to five minutes) (Step 102e); (f) raising the upper tool to provide access to the panel or rigidcomponent (Step 102 f); and/or (g) removing the rigid component from thepress (102 g).

According to an exemplary embodiment, the step of providing a carrierhaving a transfer image thereon (Step 103) may include one or more ofthe following substeps in any suitable combination: (a) providing apaper, fabric, or polymer-based carrier; (b) forming a transfer image ona surface of the carrier with sublimation ink (Step 103 b); (c) printinga transfer image onto a paper carrier using sublimation ink (Step 103c); (d) placing the carrier adjacent the panel or rigid component withthe transfer image against a surface of the panel or rigid component(103 d); and/or (e) placing the carrier into the press between the uppertool and the panel or rigid component after curing the substratematerial in the press.

According to an exemplary embodiment, the step of transferring thetransfer image from the carrier to the panel or rigid component (Step104) may include one or more of the following substeps in any suitablecombination: (a) heating the sublimation ink of the transfer image tothe sublimation temperature of the sublimation ink (Step 104 a); (b)holding the carrier adjacent the panel or rigid component for sufficientduration and temperature for the sublimation ink to be absorbed into thesubstrate material of the rigid component (e.g., between approximately30 seconds and 4 minutes) (Step 104 b); (c) and/or pressing the carrierbetween the upper tool and the panel or rigid component at pressuresbetween approximately 200 and 600 psi (e.g., approximately 385-415 psi)(Step 104 c).

Forming imagery on a bath or shower panel or other rigid component usingthe materials, equipment, and process described above may offer severaladvantages over conventionally-formed products, as well as theconventional formation processes formation, decoration, and dyesublimation, such as those described above.

For example, by associating image forming (i.e., decorating) withcomponent formation, subsequent processing may be avoided. That is, byplacing the carrier into the press prior to removal and cooling of thepanel or rigid component, heat from the tools and panel or rigidcomponent causes the ink to sublimate without requiring post-formationheating of the panel or rigid component. This is also advantageous overthermoplastic components, which may be formed using cool tools, suchthat the thermoplastic component would require subsequent heating.

By using existing compression molding equipment (i.e., press and toolsfor compression molding) for the decorating process without significant(or any) modification, the cost, space, and operation of additionalequipment (e.g., heating and/or conventional dye sublimation equipment,specialized printers, etc.) may be avoided.

By using a polymer thermoset material, the sublimation ink may beabsorbed directly into the panel or rigid component without applicationof an additional polymer powder or gel coat. Additionally, because thesublimation ink is absorbed directly into the polymer material of therigid component, the final imagery may have greater durability thancoated components and printed/painted images, which are formed generallyas an outer layer on the surface of an article. Furthermore, thermosetcomponents, which are cured under application of heat, are rigid andself-supporting at higher temperatures (e.g., sublimation temperatures)and, as such, do not require additional support or risk significantdeformation as would thermoplastic components.

The disclosed dye sublimation process provides quicker (or instant)changeover of aesthetics as compared to other imagery methods by simplyusing a carrier with a different image. Furthermore, production volumesof decorated components may be scaled quickly with increases tocarrier/transfer image throughput (i.e., by using more printers).

Illustrative Embodiments

While various embodiments of the present invention are discussed indetail herein, it should be appreciated that the present disclosureprovides many applicable concepts that can be embodied in a wide varietyof specific contexts. The specific embodiments discussed herein aremerely illustrative of specific embodiments of the invention and do notdelimit the scope of the invention.

According to an illustrative embodiment, a decorated rigid structureincludes a thermoset material and an image. The thermoset material formsa rigid structure. The image is on a surface of the rigid structure andincludes sublimation ink absorbed in the thermoset material. 7.

In the above illustrative embodiment, the rigid structure may be a wallpanel for a bathing enclosure. The surface may surface may also faceinto the bathing enclosure.

In any of the above illustrative embodiments, the surface may be threedimensional.

In any of the above illustrative embodiments, the decorated rigidstructure may not include a polymer layer formed on the thermosetmaterial and in which the sublimation ink is absorbed.

In any of the above illustrative embodiments, the rigid structure may bea compression molded structure formed of the thermoset material. Thethermoset material may also be homogenous.

In any of the above illustrative embodiments, the thermoset material mayinclude generally evenly distributed reinforcing fibers.

In any of the above illustrative embodiments, the thermoset material mayinclude generally evenly distributed filler material.

According to another illustrative embodiment, a method of providing adecorated compression molded component includes placing a carrier with atransfer image onto the compression molded component. The compressionimage is formed of a sublimation ink. The method also includestransferring at least a portion of the sublimation ink to thecompression molded component by pressing the carrier against thecompression molded component at a pressure above approximately 100 psiand simultaneously heating the sublimation ink to between approximately300 degrees Fahrenheit and approximately 360 degrees Fahrenheit untilthe sublimation ink sublimates and is absorbed into the compressionmolded component to form a transferred image thereon

In the above illustrative embodiment, traansferring the sublimation inkmay include heating the sublimation ink to between approximately 315degrees Fahrenheit and approximately 345 degrees Fahrenheit.

In any of the above illustrative embodiments, transferring the image mayinclude pressing the carrier against the compression molded component ata pressure between approximately 200 psi and approximately 600 psi.

Any of the above illustrative embodiments may further include formingthe compression molded component. Forming the compression moldedcomponent may include inserting uncured thermoset material between anupper tool and a lower tool, and pressing the uncured thermoset materialbetween the upper tool and the lower tool until the thermoset materialis cured to form the compression molded component.

In any of the above illustrative embodiments, transferring thesublimation ink may include inserting the carrier between the upper tooland the compression molded component after the thermoset material iscured, pressing the carrier includes pressing the carrier between theupper tool and the compression molded component, and heating thesublimation ink includes heating the sublimation ink with the uppertool.

In any of the above illustrative embodiments, inserting the carrier mayoccur prior to removing the compression molded component from betweenthe upper tool and the lower tool.

In any of the above illustrative embodiments, the upper tool may have atemperature of between approximately 300 degrees Fahrenheit andapproximately 360 degrees Fahrenheit.

In any of the above illustrative embodiments, the upper tool may have atemperature of between approximately 315 degrees Fahrenheit andapproximately 345 degrees Fahrenheit.

In any of the above illustrative embodiments, the lower tool may have atemperature that is between approximately 15 degrees Fahrenheit and 45degrees Fahrenheit less than the temperature of the upper tool.

A wall for a shower enclosure may be made according to any of the aboveillustrative embodiments.

According to another illustrative embodiment, a method of forming adecorated compression molded component includes inserting uncuredthermoset material between an upper tool and a lower tool. The uppertool and the lower tool have different three-dimensional surfaces forshaping the uncured thermoset material. The method also includespressing the uncured thermoset material between the upper tool and thelower tool and simultaneiously heating the uncured thermoset material toshape and cure the thermoset material into the compression moldedcomponent. The method additionally includes inserting a carrier with animage between the compression molded component. The image is formed witha sublimation ink. The method includes pressing the carrier between theupper tool and the compression molded component until the sublimationink sublimates and is sufficiently absorbed in the thermoset material toform an image on the compression molded component. The method stillfurther includes removing the compression molded component from betweenthe upper tool and the lower tool.

In the above illustrative embodiment, the compression molded componentmay not be removed from between the upper tool and the inner tool untilafter the image is formed on the compression molded component.

In any of the above illustrative embodiments, the upper tool may heatboth the thermoset material and the sublimation ink.

In any of the above illustrative embodiments, the upper tool may heat anupper surface of the compression molded component to a temperature thatis more than approximately 15 degrees Fahrenheit higher than atemperature to which the lower tool heats a lower surface of thecompression molded component.

A wall panel for a shower enclosure may be made according to any of theabove illustrative embodiments.

As utilized herein, the terms “approximately,” “about,” “substantially”,and similar terms are intended to have a broad meaning in harmony withthe common and accepted usage by those of ordinary skill in the art towhich the subject matter of this disclosure pertains. It should beunderstood by those of skill in the art who review this disclosure thatthese terms are intended to allow a description of certain featuresdescribed and claimed without restricting the scope of these features tothe precise numerical ranges provided. Accordingly, these terms shouldbe interpreted as indicating that insubstantial or inconsequentialmodifications or alterations of the subject matter described and claimedare considered to be within the scope of the invention as recited in theappended claims.

It should be noted that the term “exemplary” as used herein to describevarious embodiments is intended to indicate that such embodiments arepossible examples, representations, and/or illustrations of possibleembodiments (and such term is not intended to connote that suchembodiments are necessarily extraordinary or superlative examples).

The terms “coupled,” “connected,” and the like as used herein mean thejoining of two members directly or indirectly to one another. Suchjoining may be stationary (e.g., permanent) or moveable (e.g., removableor releasable). Such joining may be achieved with the two members or thetwo members and any additional intermediate members being integrallyformed as a single unitary body with one another or with the two membersor the two members and any additional intermediate members beingattached to one another.

References herein to the positions of elements (e.g., “top,” “bottom,”“above,” “below,” etc.) are merely used to describe the orientation ofvarious elements in the FIGURES. It should be noted that the orientationof various elements may differ according to other exemplary embodiments,and that such variations are intended to be encompassed by the presentdisclosure.

It is important to note that the construction and arrangement of thevarious exemplary embodiments are illustrative only. Although only a fewembodiments have been described in detail in this disclosure, thoseskilled in the art who review this disclosure will readily appreciatethat many modifications are possible (e.g., variations in sizes,dimensions, structures, shapes and proportions of the various elements,values of parameters, mounting arrangements, use of materials, colors,orientations, etc.) without materially departing from the novelteachings and advantages of the subject matter described herein. Forexample, elements shown as integrally formed may be constructed ofmultiple parts or elements, the position of elements may be reversed orotherwise varied, and the nature or number of discrete elements orpositions may be altered or varied. The order or sequence of any processor method steps may be varied or re-sequenced according to alternativeembodiments. Other substitutions, modifications, changes and omissionsmay also be made in the design, operating conditions and arrangement ofthe various exemplary embodiments without departing from the scope ofthe present invention.

What is claimed is:
 1. A decorated rigid structure, comprising: athermoset material forming a rigid structure; and an image on a surfaceof the rigid structure, the image comprising sublimation ink absorbed inthe thermoset material.
 2. The decorated rigid structure of claim 1,wherein the rigid structure is a wall panel for a bathing enclosure, andthe surface faces into the bathing enclosure.
 3. The decorated rigidstructure of claim 2, wherein the surface is three dimensional.
 4. Thedecorated rigid structure of claim 1, wherein the decorated rigidstructure does not include a polymer layer formed on the thermosetmaterial and in which the sublimation ink is absorbed.
 5. The decoratedrigid structure of claim 1, wherein the rigid structure is a compressionmolded structure formed of the thermoset material.
 6. The decoratedrigid structure of claim 5, wherein the thermoset material is homogenousand includes at least one of generally evenly distributed reinforcingfibers and a filler material.
 7. A method of providing a decoratedcompression molded component, comprising: placing a carrier with atransfer image onto a compression molded component, the transfer imagebeing formed of sublimation ink; and transferring at least a portion ofthe sublimation ink to the compression molded component by pressing thecarrier against the compression molded component at a pressure aboveapproximately 100 psi and simultaneously heating the sublimation ink tobetween approximately 300 degrees Fahrenheit and approximately 360degrees Fahrenheit until the sublimation ink sublimates and is absorbedinto the compression molded component to form a transferred imagethereon.
 8. The method of claim 7, wherein transferring the sublimationink includes heating the sublimation ink to between approximately 315degrees Fahrenheit and approximately 345 degrees Fahrenheit.
 9. Themethod of claim 7, wherein transferring the image includes pressing thecarrier against the compression molded component at a pressure betweenapproximately 200 psi and approximately 600 psi.
 10. The method of claim7, further comprising forming the compression molded component; whereinforming the compression molded component includes inserting uncuredthermoset material between an upper tool and a lower tool, and pressingthe uncured thermoset material between the upper tool and the lower tooluntil the thermoset material is cured to form the compression moldedcomponent; and wherein transferring the sublimation ink includesinserting the carrier between the upper tool and the compression moldedcomponent after the thermoset material is cured, pressing the carrierincludes pressing the carrier between the upper tool and the compressionmolded component, and heating the sublimation ink includes heating thesublimation ink with the upper tool.
 11. The method of claim 10, whereininserting the carrier occurs prior to removing the compression moldedcomponent from between the upper tool and the lower tool.
 12. The methodof claim 10, wherein the upper tool has a temperature of betweenapproximately 300 degrees Fahrenheit and approximately 360 degreesFahrenheit.
 13. The method of claim 12, wherein the upper tool has atemperature of between approximately 315 degrees Fahrenheit andapproximately 345 degrees Fahrenheit.
 14. The method of claim 12,wherein the lower tool has a temperature that is between approximately15 degrees Fahrenheit and 45 degrees Fahrenheit less than thetemperature of the upper tool.
 15. The method of claim 10, wherein thecompression molded component is a wall panel for a shower enclosure. 16.A method of forming a decorated compression molded component,comprising: inserting uncured thermoset material between an upper tooland a lower tool, the upper tool and the lower tool having differentthree-dimensional surfaces for shaping the uncured thermoset material;pressing the uncured thermoset material between the upper tool and thelower tool and simultaneiously heating the uncured thermoset material toshape and cure the thermoset material into a compression moldedcomponent; inserting a carrier with an image between the compressionmolded component and the upper tool, the image being formed with asublimation ink; pressing the carrier between the upper tool and thecompression molded component until the sublimation ink sublimates and issufficiently absorbed in the thermoset material to form an image on thecompression molded component; and removing the compression moldedcomponent from between the upper tool and the lower tool.
 17. The methodof claim 16, wherein the compression molded component is not removedfrom between the upper tool and the inner tool until after the image isformed on the compression molded component.
 18. The method of claim 16,wherein the upper tool heats both the thermoset material and thesublimation ink.
 19. The method of claim 18, wherein the upper toolheats an upper surface of the compression molded component to atemperature that is more than approximately 15 degrees Fahrenheit higherthan a temperature to which the lower tool heats a lower surface of thecompression molded component.
 20. The method of claim 16, wherein thecompression molded component is a wall panel for a shower enclosure.